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Synaptics Launches Ultra-Low-Power Triple Combo Wireless SoC Family with Auracast

Synaptics has extended its Veros Triple Combo connectivity portfolio with the launch of the latest SYN461x family of ultra-low-power Wi-Fi 2.4/5/6 GHz, Bluetooth 6.0, Bluetooth LE Audio with Auracast, and IEEE 802.15.4 (Zigbee/Thread) systems on chip (SoCs). Designed for embedded applications in Edge AI connected devices, the Veros SYN461x family is optimized for system integration, size, and rapid time to market.

Synaptics has extended its Veros Triple Combo connectivity portfolio with the launch of the latest SYN461x family of ultra-low-power Wi-Fi 2.4/5/6 GHz, Bluetooth 6.0, Bluetooth LE Audio with Auracast, and IEEE 802.15.4 (Zigbee/Thread) systems on chip (SoCs). Designed for embedded applications in Edge AI connected devices, the Veros SYN461x family is optimized for system integration, size, and rapid time to market.
 

According to Synaptics, this SYN461x family of wireless SoCs offers outstanding rate-over-range and seamless interoperability to target the emerging market opportunity of smart home finally enabled by the Matter standard, apart from other connected applications in buildings, public spaces, and offices. The versatile Matter-compliant SoCs offer advanced Bluetooth features, such as Channel Sounding and LE Audio — including Auracast — enabling developers to target consumer and commercial applications tailored for devices such as wearables, smart watches, audio speakers and headsets, home appliances, and many more.

Launched in 2024, Veros Seamless Intelligent Connectivity encapsulates decades of field-hardened technology and IoT connectivity expertise. It encompasses Synaptics’ entire wireless portfolio of proven solutions characterized by performance, interoperability, coexistence, power efficiency, and bill of materials integration. Veros features built-in support for Synaptics Astra, the AI-Native compute platform for the connected devices.

“The SYN461x family is a breakthrough addition to our Veros portfolio,” says Vineet Ganju, VP of Wireless Product Marketing at Synaptics. “The SoCs are our first in a series designed from the ground up for ULP embedded Edge AI IoT applications. We believe their low-power architecture, software support, and low-density packaging extend our broad-market reach and position us to share in a ~$3.2 billion market opportunity.”

 

The SYN461x family extends Synaptics’ Triple Combo series into ultra-low power, highly optimized connected applications where it delivers reliable connectivity of up to 50Mbps while extending battery life and maximizing range. Outstanding features include up to tri-band 1×1 Wi-Fi support across 2.4, 5, and 6 GHz with power-optimized architecture; low-power Bluetooth/BLE with Channel Sounding for precise distance measurement; and IEEE 802.15.4 (Thread/Zigbee) with Matter support for seamless interoperability across popular low-power networks.

The new Veros chips also have an integrated Tx/Rx switch, LNAs, and PAs that reduce size, BOM, and system cost, while simplifying design by only requiring a direct antenna connection. Available in a low-pin-count WLBGA package option for low-cost, plated-through-hole (PTH) PCBs, it allows a 25% reduction in typical board cost. The SYN461x family offers an integrated processor that offloads the host application processor to help minimize system power consumption, plus Secure Boot to help ensure system integrity.

The Veros SYN461x family is available now and unveiled at Embedded World 2025, in Nuremberg, Germany. #EW2025

www.synaptics.com


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