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Forget the M3 and A17 Pro, Apple might already be designing chips using TSMC’s 2nm fabrication process


Apple’s latest Mac and iPhone chips might be its most capable yet using TSMC’s 3nm manufacturing process, but the company might already be hard at work on the next generation of silicon according to a new report. However, the source of the leak isn’t one that we’re familiar with although it was later shared by the reputable @Tech_Reve account on X. With that in mind it’s important to remember that none of this is confirmed and won’t be for some time yet. However, it’s still worth exploring given the potential timeline for Apple’s switch to a smaller TSMC fabrication process.

The leak from gamma0burst claims that Apple is already developing new chips that are based on TSMC’s 2nm process but it isn’t clear when the chips will be released nor which devices could debut them. The leak appears to be heavily redacted documentation that not only details Apple’s plans but also those of Qualcomm, Samsung, Google, and AMD.




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